Semiconductor Wafer Inspection System

Introduction of new surfscan SP2XP, a new keep track of for wafer inspection method for the integrated circuit has built a success upon its predecessor tool with the identical name. The new wafer inspection system features enhanced sensitivity to defects on silicone, poly and metal films. It also has the capacity to sort defects by the kind and size. This new semiconductor wafer inspection program also attributes vacuum handling and best-in-class throughput.

This method is developed and manufactured to enable facilitate chipmakers to bring in their devices towards the marketplace with superior high quality and in minimal quantity of time. This method has an integrated ultra substantial sensitivity operating mode to speed up the process of improvement of next generation devices.

This SP2 system is created for 65 and 45 nm nodes and below. This slip in new UV laser technologies, dark area optics and advanced algorithms. This tool is developed to continuously offer trustworthy and correct defects in engineered substrates. This tool is developed to detect defect patterns of 6 nm or greater in a multilayered wafer patterns at a fairly higher speed. The false alarm rate is designed to be much less than 0.5 occurrences per chip.

The performance is accomplished by making use of the optical create and also the digital style pattern data. The main function of the digital design pattern data is to isolate the defective locations into distinct layers, so as to facilitate the isolation in the defects. The image is processed in one pass by an image processer that has substantial speed pipeline structured and which can detect for defects at a video rate of 7 mega hertz.

This semiconductor wafer inspection method technology is developed to deal with the needs to swiftly detect the defective materials to ensure that the issue could be rectified sooner. To sooner lesser will be the wafer scrap, yield loss and market delay. This technology is believed to really boost the manufacturing of major edge devices with minimal defects at a lesser time frame.

The positive aspects with the surfscan SP2XP monitor wafer inspection system contain thirty six percent increases inside the throughput resulting from changes in opto-mechanics, electronics and software program. The multi channel architecture enables the wafer inspection system to automatically separate particles from micro scratches, voids, water marks and so on. Ultra high sensitivity mode enables the system to be used for improvement of subsequent generation chips. The introduction of Opto-mechanics has proved to become successful in detecting defects even more than rough films. The new differential interference contrast channel enables capture of shallow, flat and faint defects which can result in failure of devices at advanced devices. The defect sizing capability enables detecting defects at greater speed with greater accuracy.